POS-150 G3P
August 20, 2026
SIO-300-200 Series Low Temperature Vacuum Oven
August 20, 2026
POS-200 G3
Features
• Less than 20 second cycle time maximizes production
• Small footprint saves valuable fab floor space
• Automatic SMIF cassette load and unload
• Adjustable loading height provides ergonomic efficiency
• Special design for class 1 condition
• Protrusion sensor to prevent wafer breakage
• Bumping detection to avoid human hurt when close pod
Specifications
| Classification | POS 150-G3P |
| Substrate | Wafer |
| Reticle/Wafer size | 150mm |
| Dimensions (Wx Dx H) | 305 x 440 x 695 mm |
| Working Height | 725mm (include Pod shell) |
| Elevator Stroke | 350mm |
| Load Capacity | 5.4kg |
| Pod Interface | SEMI E19-0697、SEMI E19.3-0697 |
| Power requirement | 110V/220V, 3A/1.4A, 50/60Hz |
| Weight | 22kg without Pod |
| Air Purity | Class 1 |
| Start up | < 20 seconds |
| Open Pod | < 13 seconds |
| Close Pod | < 16 seconds |
| Elevator Accuracy | ± 0.1mm |
| Clip stop device | Bumping strip sensor |
| Pod PIP sensor | 1 set |
| Reticle/Wafer protrusion sensor | 1 set |
| Cassette protrusion sensor | 1 set |
| Communication Interface | EIA-RS232C(SECS I/II) |
| ID device(Optional) | RFID module or IR Link |
| Remote power off | YES |
| Operation | Operational panel / Host communication |
| Environment | Operating Temperature 5-40℃ Operating Humidity 5%-90% |
| Uptime | 99% |
| MTBF | ≧ 50,000 cycles |
| MTTR | ≦ 1 hour |
Note: Specifications are subject to change without prior notice.
