POS-200 G3
August 20, 2026
FVO-450 Series High Temperature Vacuum Oven
August 20, 2026
SIO-300-200 Series Low Temperature Vacuum Oven
Features
• The Oven system has integrated mini-environment, 300mm load ports, wafer robot, cassette robot, and oven and control unit.
• Field proven application: 3DIC baking, photo-resist baking, moist removal, reflow and thermal process.
• 200mm cassette manual/auto load available.
• 25 PCS of Wafer per cassette
• Wide operating range: ambient ~ 250 °C.
• Full automatic.
• Friendly operational interface.
• Class 10 for Baking Chamber. Better Class 10 for Oven System
• Process Gas Input: N2
• Nitrogen Consumption: 0~50L/min
• Temperature Uniformity: ± 3.5oC
• Number of Recipe: Programmable
• Wafer and robotic arm protrusion detection
• Main controller: IPC – Windows 10 or newer
• Modular design minimizes adjustments, maintenance and downtime
• Thermal Chamber complies SEMI S2 S8 standard
Features
The SIO-300-200 is a very successful TC chamber system. Its extreme-clean thermal chamber improves the yield of products obviously. The very low running cost on gas and energy consumption reduce the running cost very obvious. Which make it be a favorite process oven system.
The SIO-300-200 can be used for Atmosphere curing. Tts cleanness can reach class 10 easily and temperature uniformity +/- 3.5 degree. Its gentle heating way cure wafer very safety – no overheating on the surface of wafer.
Applications
- 3DIC Profile Curing
- Photo-resist Baking
- Moist removal
- Reflow
- Anneal
- No Oxidation Baking(vacuum)
- Toxic vapor removal(vacuum)
- Other Thermal Process
Specifications
| Model | SIO-300-200-3T | SIO-300-200-5H |
| Dimensions (Wx Dx H)mm | 2860 x 2761 x 2347 mm | 3666 x 2072 x 2330 mm |
| Weight | 1850 kg | 2750 kg |
| Temperature Range | Ambient +20°C to 250°C | Ambient +20°C to 250°C |
| Wafer Orientation | Vertical | Horizontal |
| Number of Oven | 2 | 4 |
| Wafer Robot | Single Arm | Dual Arm |
| End-Effector | Single Blade | 1+5 Blade |
| Cassette Robot | Vertical cassette transfer | NA |
| No of Load ports | 4 | 4 |
| Cassette turn | Vertical | NA |
| Cool station | 3 | 4 |
| Air Purity | Class 10 | |
| Power Supply | 1~+PE 220VAC 50/60Hz | |
| Utilities Requirements | CDA Pressure：0.55MPa ~ 0.75MPa (Φ12mm quick connection fitting)
Vacuum Pressure：-80kPa ~ -100kPa (Φ12mm quick connection fitting) N2 Pressure：0.55MPa ~ 0.75MPa (Ø8 quick connection fitting) General Exhaust：Φ12mm quick connection fitting Exhaust (Hot Air): 2”(Round duct collar) x2 Acid Exhaust：KF25 x2 |
CDA Pressure：0.55MPa ~ 0.75MPa (Ø12 quick connection fitting)
CDA Pressure：0.55MPa ~ 0.75MPa (Ø12 quick connection fitting) Vacuum Pressure：-80k ~ -100 kPa (Ø12 quick connection fitting) N2 Pressure：0.55MPa ~ 0.75MPa (Ø8 quick connection fitting) General Exhaust：Ø12 quick connection fitting Exhaust (Hot Air): 2”(Round duct collar) x4 Acid Exhaust：KF25 x4 |
| Environment | Operating Temperature 5-40℃
Operating Humidity 35%-55% |
|
| Communication Interface | SECS (HSMS-SS) | |
